Authors:
Yi-Chang Chiu, University of Arizona, USA
Jon Bottom, Steer Davies Gleave, Inc., USA
Michael Mahut, INRO Inc., Canada
Alexander Paz, University of Nevada at Las Vegas, USA
Ramachandran Balakrishna, Caliper Inc., USA
Travis Waller, University of Texas at Austin, USA
Jim Hicks, Parsons Brinkerhoff, Inc., USA





